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High TG ENIG IPC 6012D 1oz Multilayer PCB Assembly

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Shenzhen Shinelink Technology Ltd

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High TG ENIG IPC 6012D 1oz Multilayer PCB Assembly

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Brand Name :	Shinelink
Model Number :	SL00718S05
Certification :	UL, Rohs
Price :	Negotiable
Payment Terms :	L/C, T/T, Western Union, MoneyGram
Supply Ability :	5000 Piece/Pieces per Day
Delivery Time :	7-12 days

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Product Details
Company Profile

High TG ENIG IPC 6012D 1oz Multilayer PCB Assembly

SMT PCB Assembly manufacturing of multilayer 1oz FR4 High TG ENIG IPC-6012D

● Founded in 2000 with ISO-9001 and SGS certificates, located in Longhua District, Shenzhen City, focus on PCB and PCB assembly manufacturing and turnkey project management and start overseas business from 2007 and also design and produce our own product from 2011, like power supply product
● 2 plants in main China, about 500 staffs, the one is our overseas PCB and PCBA business plant with our sample producing line and our R&D department and the other is our mass producing plant ,about 8000 square meters workshop.
8Hi-speed SMT lines, 5 DIP lines and 2 testing line and 2 packing lines,
● 8 R&D engineers
● Ensure you don't deal with middle men to save your both time and money
● and provide turnkey serivce to release your energy on design and market.
● Sign NDA file to protect your design safety
● Marketing: export:80% local:20

Files Requested For PCB Assembly Quotation

---In order to provide you with the most efficient and accurate quote on manufacturing the requested unit, we ask that you provide us with the following information.
1. Gerber file,PCB file,Eagle file or CAD file are all acceptable
2. A detailed bill of materials (BOM)
3. Clear pictures of PCB or PCBA sample for us
4. Quantity and delivery required
5. Test method for PCBA to guarantee 100% good quality products.
6. Schematics file for PCB design if need to do function test.
7. A sample if available for better sourcing
8. CAD files for enclosure manufacturing if required
9. A complete wiring and assembly drawing showing any special assembly instructions if required

Shinelink kinds PCBA product

94V0 PCBA manufacture Scale capabilities up to
We combine advanced processes with highly skilled resources. Keeping up with the leading advanced technology and management system in One-stop services of PCB assembly
SMT process (RoHs Compliant) Capabilities up to:
1. 0201 Chip Size
2. 12 mils Integrated Circuit (IC) Pitch
3. Micro Ball Grid Array (BGA) – Pitch 16 mils
4. Flip Chip (Controlled Collapse Chip Connection) – Pitch 5 mils
5. Quad Flat Package (QFP) – Pitch 12 mils
THT(Wave soldering) process (RoHs Compliant) Capabilities up to:

1.Single side wave soldering
2.SMT & THT mixture process
Rigid 1oz Copper PCBA Board Assembly PCB 2 Layer ODM PCBA Immersion Gold

PCB Assembly Capabilities

Turnkey PCBA	PCB+components sourcing+assembly+package
Assembly details	SMT and Thru-hole, ISO lines
Lead Time	Prototype: 15 work days. Mass order: 20~25 work days
Testing on products	Flying Probe Test, X-ray Inspection, AOI Test, functional test
Quantity	Min quantity: 1pcs. Prototype, small order, mass order, all OK
Files we need	PCB: Gerber files(CAM, PCB, PCBDOC)
	Components: Bill of Materials(BOM list)
	Assembly: Pick-N-Place file
PCB panel Size	Min size: 0.250.25 inches(66mm)
PCB panel Size	Max size: 2020 inches(500500mm)
PCB Solder Type	Water Soluble Solder Paste, RoHS lead free
Components details	Passive Down to 0201 size
	BGA and VFBGA
	Leadless Chip Carriers/CSP
	Double-sided SMT Assembly
	Fine Pitch to 0.8mils
	BGA Repair and Reball
	Part Removal and Replacement
Component package	Cut Tape,Tube,Reels,Loose Parts
PCB assembly process	Drilling-----Exposure-----Plating-----Etaching & Stripping-----Punching-----Electrical Testing-----SMT-----Wave Soldering-----Assembling-----ICT-----Function Testing-----Temperature & Humidity Testing

PCBA Picture
High TG ENIG IPC 6012D 1oz Multilayer PCB Assembly

FAQ:

1. What factors should be considered when choosing the material for a PCB board?

Below factors should be considered when we choose the material for PCB:
The material’s Tg value should be greater than the operation temperature;
Low CTE material has good performance of thermal stability;
Good thermal resistance performance: Normally PCBs are required to resist 250℃ for at least 50s.
Good flatness; In consideration of the electrical properties, low loss/high permittivity material is used on high frequency PCB; Polyimide glass fiber substrate used for flexible PCB; Metal core is used when the product has strict requirement of heat dissipation.
2. What’s the merits of O-leading's rIgid-flex PCB?

SHINELINK’s rigid-flex PCB has the characters of both FPC and PCB, so it can be used in some special products. Some part is flexible while the other part rigid, it can help save product’s interior space, reduce product volume and improve performance.
3. How to you make the impedance calculation?

The impedance control system is done using some test coupons, the SI6000 soft and the CITS 500s equipment from POLAR INSTRUMENTS.
The equipment measures the impedance on a representative track configuration coupon of which the client has given us a determinate value and tolerance.

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