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Bluetooth Headset Customizable 0.5mm SMT PCB Assembly

Shenzhen Shinelink Technology Ltd
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    Buy cheap Bluetooth Headset Customizable 0.5mm SMT PCB Assembly from wholesalers
     
    Buy cheap Bluetooth Headset Customizable 0.5mm SMT PCB Assembly from wholesalers
    • Buy cheap Bluetooth Headset Customizable 0.5mm SMT PCB Assembly from wholesalers
    • Buy cheap Bluetooth Headset Customizable 0.5mm SMT PCB Assembly from wholesalers
    • Buy cheap Bluetooth Headset Customizable 0.5mm SMT PCB Assembly from wholesalers

    Bluetooth Headset Customizable 0.5mm SMT PCB Assembly

    Ask Lasest Price
    Brand Name : OEM/ODM
    Model Number : SL00820S02
    Certification : UL, Rohs
    Price : Negotiable
    Payment Terms : L/C, T/T, Western Union, MoneyGram
    Supply Ability : 5000 Piece/Pieces per Day
    Delivery Time : 7-12 days
    • Product Details
    • Company Profile

    Bluetooth Headset Customizable 0.5mm SMT PCB Assembly

    Customizable SMT PCB Assembly , Bluetooth Headset Circuit Board Assembly


    This PCBA Board is assembled with FR - 4 made bare pcb board and the board thickness is 1.6 mm, copper thickness is normally 1OZ / 35 µm. Immersion gold surface treatment make the PCBa work longer and more eco-friendly. We need Gerber File & BOM List to produce your PCBa assembly order.


    Files Requested For PCB Assembly Quotation


    ---In order to provide you with the most efficient and accurate quote on manufacturing the requested unit, we ask that you provide us with the following information.
    1. Gerber file,PCB file,Eagle file or CAD file are all acceptable
    2. A detailed bill of materials (BOM)
    3. Clear pictures of PCB or PCBA sample for us
    4. Quantity and delivery required
    5. Test method for PCBA to guarantee 100% good quality products.
    6. Schematics file for PCB design if need to do function test.
    7. A sample if available for better sourcing
    8. CAD files for enclosure manufacturing if required
    9. A complete wiring and assembly drawing showing any special assembly instructions if required


    Shinelink kinds PCBA product


    Rigid 1oz Copper PCBA Board Assembly PCB 2 Layer ODM PCBA Immersion Gold



    94V0 PCBA manufacture Scale capabilities up to

    We combine advanced processes with highly skilled resources. Keeping up with the leading advanced technology and management system in One-stop services of PCB assembly

    SMT process (RoHs Compliant) Capabilities up to:

    1. 0201 Chip Size
    2. 12 mils Integrated Circuit (IC) Pitch
    3. Micro Ball Grid Array (BGA) – Pitch 16 mils
    4. Flip Chip (Controlled Collapse Chip Connection) – Pitch 5 mils
    5. Quad Flat Package (QFP) – Pitch 12 mils

    THT(Wave soldering) process (RoHs Compliant) Capabilities up to:


    1.Single side wave soldering

    2.SMT & THT mixture process

    Rigid 1oz Copper PCBA Board Assembly PCB 2 Layer ODM PCBA Immersion Gold



    PCB Assembly Capabilities

    Turnkey PCBAPCB+components sourcing+assembly+package
    Assembly detailsSMT and Thru-hole, ISO lines
    Lead TimePrototype: 15 work days. Mass order: 20~25 work days
    Testing on productsFlying Probe Test, X-ray Inspection, AOI Test, functional test
    QuantityMin quantity: 1pcs. Prototype, small order, mass order, all OK
    Files we needPCB: Gerber files(CAM, PCB, PCBDOC)
    Components: Bill of Materials(BOM list)
    Assembly: Pick-N-Place file
    PCB panel SizeMin size: 0.25*0.25 inches(6*6mm)
    Max size: 20*20 inches(500*500mm)
    PCB Solder TypeWater Soluble Solder Paste, RoHS lead free
    Components detailsPassive Down to 0201 size
    BGA and VFBGA
    Leadless Chip Carriers/CSP
    Double-sided SMT Assembly
    Fine Pitch to 0.8mils
    BGA Repair and Reball
    Part Removal and Replacement
    Component packageCut Tape,Tube,Reels,Loose Parts
    PCB assembly
    process
    Drilling-----Exposure-----Plating-----Etaching & Stripping-----Punching-----Electrical Testing-----SMT-----Wave Soldering-----Assembling-----ICT-----Function Testing-----Temperature & Humidity Testing



    PCBA Picture

    Bluetooth Headset Customizable 0.5mm SMT PCB Assembly


    FAQ:


    1. What’s the typical process flow for multi-layer PCB?


    Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.


    2. What’s the key equipments for HDI manufacturing?


    Key equipment list is as following: Laser drilling machine, Pressing machine, VCP line, Automatic Exposing machine, LDI and etc.

    The equipments we have are the best in the industry, laser drilling machines are from Mitsubishi and Hitachi, LDI machines are from Screen(Japan), Automatic Exposing machines are also from Hitachi, all of them make we can meet customer’s technical requirements.


    3. How many types of surface finish SHINELINK can do?


    SHINELINK has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.


    4. What’s your capability for FPC? Can SHINELINK provide SMT service also?


    SHINELINK can fabricate FPC from single layer to 8layer, the working panel size can be as large as 2000mm*240mm, please find the details in the page “Flex Capability”

    We also provide SMT one stop service to customer.

    Quality Bluetooth Headset Customizable 0.5mm SMT PCB Assembly for sale
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